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IC Chemical Processing
IC Failure Analysis
FIB Application
ESD/Latch-up Test
 
 
   芯片失效分析 →
芯片开封
SEM&EDX
EMMI Application
OBIRCH Application
De-Gold Bump
X-Ray Application
SAM Application
 
IC Decapsulation

开封, 即开盖/开帽, 指去除ic封胶, 同时保持芯片功能的完整无损, 保持 die, bond pads, bond wires乃至lead-frame不受损伤, 为下一步芯片失效分析实验做准备.
去封范围 * 普通封装

* COB、BGA

* 陶瓷、金属等其它特殊封装

 

 
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